Characteristics of laser drilling small holes
Laser drilling small holes uses high-energy-density lasers as a heat source to produce local instantaneous high temperatures at the processing point of the processed material, which becomes molten or vaporized to remove the material.
When the laser with extremely high energy density irradiates the surface of the processed part, the light energy is absorbed by the surface of the part and converted into heat energy, causing the irradiated local area to quickly melt and vaporize, first forming a small pit.
As the light energy is absorbed, the metal vapor in the pit expands rapidly, and the pressure suddenly increases, which has a strong impact on other parts, causing the steam and molten material to be explosively ejected at high speed, and a small hole with a certain taper is processed on the workpiece.
Characteristics of laser processing
1. It has nothing to do with the hardness of the material, and can drill holes in almost all materials with fast speed, high efficiency and small heat-affected zone
2. There is no problem of tool loss, and there is almost no macroscopic force on the workpiece, so it can drill holes on easily deformed workpieces, and it is easy to realize automatic continuous operation
3. It can process fine and deep small holes. The diameter of the small hole can be as small as 4-5um, and the aspect ratio can reach more than 10.
4. The processed small hole has large roughness and poor roundness, and is easy to form a bell mouth. The accuracy of the hole is generally lower than the working grade.
5. Affected by the output power and focusing, it is generally only suitable for processing small holes on thin plates.
